博彩快三

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                电话:0512-65821886 地址:苏州市工业园区新平街388号腾飞创新园A1栋
                键合

                MEMS加工—键合

                键合将两片表面清洁、原子级平♂整的同质或异质半导体材料经表面清洗和活化处理,在一定条件下直接结合,通过范德华力、分子力甚至原子力使晶片键合成为一体的技术。
                • 产品介绍
                • 案例展示
                阳极键合:
                ● 适用于硅片与玻璃,金属与玻璃、半导体与合金、半导体与玻璃间◣的键合
                共晶键合:
                ● 适用于PbSn,AuSn,CuSn,AuSi等材料
                胶键合:
                ● 采用键合专用胶,适用于AZ4620,SU8等键合专¤用胶
                ● 适用4寸、6寸
                 
                阳极键合
                阳极键合